Ceramic Bond Diamond Polishing Pad

  • Diameter 76mm and 100mm
  • Thickness 10mm
  • Ceramic Bond
  • Grit 30#, 50#, 100#, 200#, 400#
  • with Velcro Back

  • Description
  • Detail Photos
  • Inquiry

Ceramic Bond Diamond Polishing Pad is one of our transitional bond polishing pads designed with velcro back. Choosing ceramic as bond agent will contribute to the best grinding performance. Ceramic bond diamond polishing pad, as the transitional polishing tools between metal bond tools and resin bond tools, will remove metal bond scratches quicker than traditional hybrid series tooling and will not build heat during the cutting process which therefore maintains a cooler operational temperature that ultimately increases tool life. Diameters are available in 76mm and 100mm. And grit numbers are 30#, 50#, 100#, 200#, 400#.

 Item No. Diameter Thickness Grit Bond Agent
 MT-CDP3  76mm 10mm 30#, 50#, 100#, 200#, 400#  Ceramic
 MT-CDP4  100mm 10mm 30#, 50#, 100#, 200#, 400#  Ceramic

Diameters are available in 80mm and 100mm. We recommend 100mm diameter ceramic bond diamond polishing pads for Mars Grinding Machine.


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